Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging
by John Hoon Lee (9781598292442)

Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging
 

John Hoon Lee


Release Date: 01 June 1905
Format: Paperback / softback
Pages: 116
Category: Mathematical Physics
Publisher: Morgan & Claypool
ISBN: 9781598292442
ISBN-10: 1598292447



This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCe V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

AUD $67.95

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